Interconnect structure and method of forming same

ABSTRACT

A device includes a first side interconnect structure over a first side of a substrate, wherein active circuits are in the substrate and adjacent to the first side of the substrate, a dielectric layer over a second side of the substrate, a pad embedded in the dielectric layer, the pad comprising an upper portion and a bottom portion formed of two different materials and a passivation layer over the dielectric layer.

This application is a continuation of U.S. patent application Ser. No.15/613,579, filed on Jun. 5, 2017, entitled “Interconnect Structure andMethod of Forming Same”, which is a continuation of U.S. patentapplication Ser. No. 14/991,560, filed on Jan. 8, 2016, entitled“Interconnect Structure and Method of Forming Same”, now U.S. Pat. No.9,679,859, issued on Jun. 13, 2017, which application is a divisional ofU.S. patent application Ser. No. 14/158,364, filed on Jan. 17, 2014,entitled “Interconnect Structure and Method of Forming Same”, now U.S.Pat. No. 9,252,110, issued on Feb. 2, 2016, which applications areincorporated herein by reference.

BACKGROUND

The semiconductor industry has experienced rapid growth due tocontinuous improvements in the integration density of a variety ofelectronic components (e.g., transistors, diodes, resistors, capacitors,etc.). For the most part, this improvement in integration density hascome from repeated reductions in minimum feature size, which allows morecomponents to be integrated into a given area. As the demand for evensmaller electronic devices has grown recently, there has grown a needfor smaller and more creative packaging techniques of semiconductordies.

As semiconductor technologies evolve, three-dimensional (3D) integratedcircuits (ICs) have emerged as an effective alternative to furtherreduce the physical size of a semiconductor chip. A 3D IC may comprise avariety of semiconductor dies stacked together. In particular, thesemiconductor dies may be bonded together through a plurality of microbumps and electrically coupled to each other through a plurality ofthrough vias. For example, active circuits such as logic, memory,processor circuits and the like are fabricated on different wafers andeach wafer die is stacked on top of another wafer die usingpick-and-place techniques. Through vias are thus used in the stackeddies for connecting dies. In some cases, through vias are often used toconnect the integrated circuits on a die to the backside of the die.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a cross sectional view of a semiconductor device inaccordance with various embodiments of the present application;

FIG. 2 illustrates a cross sectional view of forming a plurality ofopenings in a dielectric layer in accordance with various embodiments ofthe present disclosure;

FIG. 3 a cross sectional view of the semiconductor device shown in FIG.2 after a seed layer is formed on top of the dielectric layer inaccordance with various embodiments of the present disclosure;

FIG. 4 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 3 after a first metal layer is formed on top of the seedlayer in accordance with various embodiments of the present disclosure;

FIG. 5 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 4 after a second metal layer is formed on top of the firstmetal layer in accordance with various embodiments of the presentdisclosure;

FIG. 6 is a cross sectional view of the semiconductor device illustratedin FIG. 5 after a chemical mechanical polish (CMP) process has beenapplied to the backside of the substrate in accordance with variousembodiments of the present disclosure;

FIG. 7 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 6 after a passivation layer is formed over thesemiconductor device in accordance with various embodiments of thepresent disclosure;

FIG. 8 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 7 after an opening is formed in the passivation layer inaccordance with various embodiments of the present disclosure; and

FIG. 9 illustrates a cross section view of the semiconductor deviceshown in FIG. 8 after an interconnect bump is formed on the backsidecontact in accordance with various embodiments of the presentdisclosure.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the variousembodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the present embodiments are discussed in detailbelow. It should be appreciated, however, that the present disclosureprovides many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use the embodimentsof the disclosure, and do not limit the scope of the disclosure.

The present disclosure will be described with respect to embodiments ina specific context, namely an interconnect structure of a semiconductordevice. The embodiments of the disclosure may also be applied, however,to a variety of semiconductor devices of the semiconductor industry.Hereinafter, various embodiments will be explained in detail withreference to the accompanying drawings.

FIG. 1 illustrates a cross sectional view of a semiconductor device inaccordance with various embodiments of the present application. Thesemiconductor device 100 comprises a front side interconnect structure120. The front side interconnect structure 120 may comprise a pluralityof metal lines (e.g., metal lines 122, 124, 134, 136, 144 and 146) andvias (e.g., vias 132 and 142). The front side interconnect structure 120may further comprise metal pads, redistribution lines, bumps (not shownrespectively) and/or the like.

As shown in FIG. 1, the front side interconnect structure 120 is formedover a first side 101 of a substrate 102. The substrate 102 may comprisea variety of electrical circuits (e.g., transistor 105) and through vias(e.g. through via 201). The electrical circuits are formed within and onthe first side 101 of the substrate 102. Throughout the description, thefirst side 101 may be alternatively referred to as the front side of thesubstrate 102. The second side 103 may be alternatively referred to asthe backside of the substrate 102.

The semiconductor device 100 further comprises a plurality of backsideinterconnect structures (e.g., backside bump 172). As shown in FIG. 1,the backside bump 172 is formed over the second side 103 of thesubstrate 102. In particular, the bump 172 is formed on a pad 161. Asshown in FIG. 1, the pad 161 includes two portions, namely an upperportion 163 and a bottom portion 162. In some embodiments, the upperportion 163 is of a trapezoidal shape. The sidewalls of the upperportion 163 are surrounded by the bottom portion 162. The bottom portion162 may be a redistribution line according to some embodiments.

In some embodiments, the upper portion 163 is formed of nickel. Thebottom portion 162 is formed of copper. The detailed formation processof the pad 161 will be described below with respect to FIGS. 2-9.

The backside interconnect structures may further comprise a plurality ofredistribution lines 164 and 166. Throughout the description, theredistribution lines 164 and 166 are alternatively referred to as metallines 164 and 166. In some embodiments, the metal lines 164 and 166 areformed of copper. As shown in FIG. 1, the top surfaces of the metallines 164 and 166 are substantially level with the top surface of thepad 161.

The through via 201 is formed in the substrate 102. More particularly,the through via 201 extends through the substrate 102 from the firstside 101 of the substrate 102 to the second side 103 of the substrate102. As shown in FIG. 1, the through via 201 provides a conductivechannel between the front side interconnect structure 120 and thebackside interconnect structure (e.g., bump 172).

The through via 201 may be formed in a via opening, which extends deeperthan the depth of the electrical circuits (e.g., MOS transistor 105) ofthe semiconductor device 100. In order to insulate the conductivematerial of the through via 201 from the substrate 102, a liner layer203 is formed on the sidewalls of the via opening. A barrier (not shown)is formed over the liner layer 203. Furthermore, in order to facilitatethe plating process, a seed layer (not shown) may be formed over thebarrier layer. A conductive material such as copper may fill the viaopening to form the through via 201 through a plating process.

The substrate 102 may be formed of silicon, although it may also beformed of other group III, group IV, and/or group V elements, such assilicon, germanium, gallium, arsenic, and combinations thereof.

The substrate 102 may also be in the form of silicon-on-insulator (SOI).The SOI substrate may comprise a layer of a semiconductor material(e.g., silicon, germanium and/or the like) formed over an insulatorlayer (e.g., buried oxide or the like), which is formed in a siliconsubstrate. In addition, other substrates that may be used includemulti-layered substrates, gradient substrates, hybrid orientationsubstrates and/or the like.

The substrate 102 may further comprise a variety of electrical circuits(e.g., transistor 105). The electrical circuits formed on the substrate102 may be any type of circuitry suitable for a particular application.In accordance with an embodiment, the electrical circuits may includevarious n-type metal-oxide semiconductor (NMOS) and/or p-typemetal-oxide semiconductor (PMOS) devices such as transistors,capacitors, resistors, diodes, photo-diodes, fuses and/or the like. Theelectrical circuits may be interconnected to perform one or morefunctions. The functions may include memory structures, processingstructures, sensors, amplifiers, power distribution, input/outputcircuitry and/or the like.

As shown in FIG. 1, a metal oxide semiconductor (MOS) transistor 105 andits associated contact plug 118 are used to represent the electricalcircuits of the semiconductor device 100. The MOS transistor 105 isformed in the substrate 102. The MOS transistor 105 includes twodrain/source regions 106. As shown in FIG. 1, the drain/source regions106 are formed on opposite sides of a gate stack. The gate stackincludes a gate dielectric layer 112 formed over the substrate 102, agate electrode formed over the gate dielectric layer 112 and gatespacers 116. As shown in FIG. 1, there may be two isolation regions 104formed on opposite sides of the MOS transistor 105.

The isolation regions 104 may be shallow trench isolation (STI) regions,and may be formed by etching the substrate 102 to form a trench andfilling the trench with a dielectric material as is known in the art.For example, the isolation regions 104 may be filled with a dielectricmaterial such as an oxide material, a high-density plasma (HDP) oxideand/or the like. A planarization process such as a chemical mechanicalpolishing (CMP) process may be applied to the top surface so that theexcess dielectric material may be removed as a result.

The gate dielectric 112 may be a dielectric material such as siliconoxide, silicon oxynitride, silicon nitride, an oxide, anitrogen-containing oxide, a combination thereof and/or the like. Thegate dielectric 112 may have a relative permittivity value greater thanabout 4. Other examples of such materials include aluminum oxide,lanthanum oxide, hafnium oxide, zirconium oxide, hafnium oxynitride,combinations thereof and/or the like. In an embodiment in which the gatedielectric 112 comprises an oxide layer, the gate dielectrics 112 may beformed by a plasma enhanced chemical vapor deposition (PECVD) processusing tetraethoxysilane (TEOS) and oxygen as a precursor. In accordancewith an embodiment, the gate dielectric 112 may be of a thickness in arange from about 8 Å to about 200 Å.

The gate electrode 114 may comprise a conductive material, such as ametal (e.g., tantalum, titanium, molybdenum, tungsten, platinum,aluminum, hafnium, ruthenium), a metal silicide (e.g., titaniumsilicide, cobalt silicide, nickel silicide, tantalum silicide), a metalnitride (e.g., titanium nitride, tantalum nitride), dopedpoly-crystalline silicon, other conductive materials, combinationsthereof and/or the like. In an embodiment in which the gate electrode114 is poly-silicon, the gate electrode 114 may be formed by depositingdoped or undoped poly-silicon by low-pressure chemical vapor deposition(LPCVD) to a thickness in the range of about 400 Å to about 2,400 Å.

The spacers 116 may be formed by blanket depositing one or more spacerlayers (not shown) over the gate electrode 114 and the substrate 102.The spacer layers 116 may comprise suitable dielectric materials such asSiN, oxynitride, SiC, SiON, oxide and/or the like. The spacer layers 116may be formed by commonly used techniques such as chemical vapordeposition (CVD), PECVD, sputter and/or the like.

The drain/source regions 106 may be formed in the substrate 102 onopposing sides of the gate dielectric 112. In an embodiment in which thesubstrate 102 is an n-type substrate, the drain/source regions 106 maybe formed by implanting appropriate p-type dopants such as boron,gallium, indium and/or the like. Alternatively, in an embodiment inwhich the substrate 102 is a p-type substrate, the drain/source regions106 may be formed by implanting appropriate n-type dopants such asphosphorous, arsenic and/or the like.

An interlayer dielectric layer 115 is formed on the first side 101 ofthe substrate 102. The interlayer dielectric layer 115 may be formed,for example, of a low-K dielectric material, such as silicon oxide. Theinterlayer dielectric layer 115 may be formed by any suitable methodknown in the art, such as spinning, CVD and PECVD). It should also benoted that one skilled in the art will recognize while FIG. 1illustrates a single interlayer dielectric layer, the interlayerdielectric layer 115 may comprise a plurality of dielectric layers.

As shown in FIG. 1, the interlayer dielectric layer 115 is formed on thefirst side 101 of the substrate 102. There may be a contact plug 118formed in the interlayer dielectric layer 115. The contact plug 118 isformed through the interlayer dielectric layer 115 to provide anelectrical connection between the MOS transistor 105 and the front sideinterconnect structure 120 formed over the interlayer dielectric layer115.

The contact plug 118 may be formed by using photolithography techniquesto deposit and pattern a photoresist material on the interlayerdielectric layer 115. A portion of the photoresist is exposed accordingto the location and shape of the contact plug 118. An etching process,such as an anisotropic dry etch process, may be used to create anopening in the interlayer dielectric layer 115.

A conductive liner may be deposited prior to filling the contact plughole. The conductive liner is preferably conformal, and may comprise asingle layer of Ta, TaN, WN, WSi, TiN, Ru and any combinations thereof.The conductive liner may be typically used as a barrier layer forpreventing the conductive material such as copper from diffusing intothe underlying substrate 102. The conductive liner may be deposited byusing suitable deposition process such as CVD, PVD, Atomic LayerDeposition (ALD) and/or the like.

A conductive material is then filled in the opening. The conductivematerial may be deposited by using CVD, PVD or ALD. The conductivematerial is deposited over the conductive liner to fill the contact plugopening. Excess portions of the conductive material are removed from thetop surface of the interlayer dielectric layer 115 by using aplanarization process such as CMP. The conductive material may becopper, tungsten, aluminum, silver, titanium, titanium nitride, tantalumand combinations thereof and/or the like.

The front side interconnect structure 120 may comprise a plurality ofmetal lines. The metal lines may be formed in different layers andseparated by inter-layer dielectric layers and inter-metal dielectricslayers. The semiconductor device 100 may include up to eightmetallization layers, or even more. The metallization layer immediatelyover the interlayer dielectric layer 115 is referred to as the bottommetallization layer (M1), and the metallization layer in which bond pads(not shown) are formed is referred to as the top metallization layer(TM).

As shown in FIG. 1, the bottom inter-metal dielectric layer 128 isformed over the interlayer dielectric layer 115. There may be two metallines 122 and 124 embedded in the inter-layer dielectric layer 115. Themetal lines 122 and 124 may be formed through a damascene process,whereby masks are deposited onto the surface of the bottom inter-metaldielectric layer 128, holes are etched into the surface, and conductivematerial (such as tungsten or copper) is used to fill the holes.

The bottom inter-metal dielectric layer 128 may be formed of a low-Kdielectric material such as fluorosilicate glass (FSG) and/or the like.The inter-metal dielectric layer 128 may be formed by suitabledeposition techniques such as PECVD, high-density plasma chemical vapordeposition (HDPCVD) and/or the like.

It should be noted that the semiconductor device 100 may accommodate anynumber of metallization layers. For simplicity, only three metallizationlayers are illustrated herein. The inter-metal dielectric layer 138 andthe inter-metal dielectric layer 148 are similar to the bottominter-metal dielectric layer 128 except that metal lines (e.g., metallines 134 and 144) and their adjacent vias (e.g., vias 132 and 142) ofthe semiconductor device 100 are formed in a dual damascene structure.

FIGS. 2 to 9 illustrate intermediate steps of fabricating thesemiconductor device shown in FIG. 1 in accordance with variousembodiments of the present disclosure. For simplicity, only the backsidestructures and the substrate 102 are included in FIGS. 2 to 9. FIG. 2illustrates a cross sectional view of forming a plurality of openings ina dielectric layer in accordance with various embodiments of the presentdisclosure. A dielectric layer 168 is formed over the backside of thesubstrate 102. The dielectric material may comprise polybenzoxazole(PBO), SU-8 photo-sensitive epoxy, film type polymer materials and/orthe like.

In consideration of the locations of the metal lines (e.g., metal lines164 and 166) and the pad 161 shown in FIG. 1, selective areas of thedielectric layer 168 are exposed to light. As a result, a variety ofopenings (e.g., opening 202, 204 and 206) are formed. Throughout thedescription, the openings 202 and 204 are alternatively referred to asmetal line openings. The opening 206 is alternatively referred to as aredistribution line opening.

As shown in FIG. 2, the top surface of the through via 201 is exposedafter the opening 206 is formed. The formation of the openings such asopenings 202, 204 and 206 in the dielectric layer 168 involves variouslithography operations, which are well known, and hence are notdiscussed in further detail herein. One advantageous feature of theformation process described above is that the metal lines and the padare formed through one single patterning process. Such a singlepatterning process helps to reduce the fabrication cost of thesemiconductor device 100.

FIG. 3 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 2 after a seed layer is formed on top of the dielectriclayer in accordance with various embodiments of the present disclosure.The seed layer 301 is formed over the dielectric layer 168. The seedlayer 301 may comprise two portions, namely a bottom seed layer (notshown) and an upper seed layer (not shown). The bottom seed layer may bea titanium layer, a titanium nitride layer, a tantalum layer, a tantalumnitride layer and/or the like. The upper seed layer may be formed ofcopper, copper alloys and/or the like. In accordance with an embodiment,the seed layer 301 may be formed using any suitable techniques such asCVD, PVD and/or the like. It is should be noted that the seed layer 301is electrically coupled to the through via 201 after the seed layer 301is formed over the dielectric layer 168.

FIG. 4 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 3 after a first metal layer is formed on top of the seedlayer in accordance with various embodiments of the present disclosure.As shown in FIG. 4, a first conductive material may be filled in theopenings (e.g., openings 202 and 204 shown in FIG. 2) and partiallyfilled in the opening 206 (shown in FIG. 2). The first metal layer 302is formed through a plating process according to some embodiments.

The first conductive material may be copper, but can be any suitableconductive materials, such as copper alloys, aluminum, tungsten, silver,any combinations thereof and/or the like.

In some embodiments, the first metal layer 302 is formed of copper. Themetal line openings 202 and 204 are filled with copper and theredistribution line opening 206 is partially filled with copper througha first plating process. The first plating process is controlled suchthat the first metal layer 302 is of an uneven thickness. As shown inFIG. 4, the first metal layer 302 may be divided into two portions. Thefirst portion 304 is thinner than a second portion 306. In someembodiments, a ratio of a thickness of the second portion 306 to athickness of the first portion 304 is greater than 2.

FIG. 5 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 4 after a second metal layer is formed on top of the firstmetal layer in accordance with various embodiments of the presentdisclosure. As shown in FIG. 5, a second conductive material may bedeposited in a conformal manner on top of the first metal layer 302 toform an additional conductive layer 402. The conductive material may benickel, but can be any suitable conductive materials, such as copperalloys, aluminum, tungsten, silver, any combinations thereof and/or thelike.

In some embodiments, the second metal layer 402 is formed of nickel. Thesecond metal layer 402 may be formed by suitable techniques such as asecond plating process. In some embodiments, the second plating processis controlled such that the second conductive layer 402 is of asubstantially uniform thickness. In other words, the thickness of theportion 404 (the portion in the opening 206) is approximately equal tothe thickness of the portion 408.

FIG. 6 is a cross sectional view of the semiconductor device illustratedin FIG. 5 after a CMP process has been applied to the backside of thesubstrate in accordance with various embodiments of the presentdisclosure. The first metal layer 302 and the second metal layer 402 areplanarized until the top surface of the pad 601 is substantially levelwith the top surfaces of the metal lines 164 and 166. As shown in FIG.6, after the planarization process, two metal lines (e.g., metal lines164 and 166) and a pad (e.g., pad 161) are formed in the dielectriclayer 168. As shown in FIG. 6, the height of the metal lines 164 and 166is approximately equal to the height of the pad 601. Such an equalheight feature may help a user to accurately create a SPICE model.

The planarization process may be implemented by using suitabletechniques such as grinding, polishing and/or chemical etching, acombination of etching and grinding techniques. In accordance with anembodiment, the thinning process may be implemented by using a CMPprocess. In the CMP process, a combination of etching materials andabrading materials are put into contact with the backside of thesubstrate and a grinding pad (not shown) is used to grind away the firstmetal layer 302 and the second metal layer 402 until the top surface ofthe dielectric layer 168 is exposed.

FIG. 7 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 6 after a passivation layer is formed over thesemiconductor device in accordance with various embodiments of thepresent disclosure. The passivation layer 178 may comprise a dielectricmaterial such as an oxide or silicon nitride, silicon oxynitride,although other suitable dielectrics, such as a high-k dielectric, mayalternatively be used. The passivation layer 178 may be formed throughany suitable techniques such as CVD, PECVD and/or the like.

FIG. 8 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 7 after an opening is formed in the passivation layer inaccordance with various embodiments of the present disclosure. Once thepassivation layer 178 is deposited on the backside of the substrate 102,in order to expose at least a portion of the pad 161, a patterningprocess may be applied to the passivation layer 178. A suitable etchingtechnique may be applied to the passivation layer 178. As a result, theopening 802 is formed and the top surface of the pad 161 is exposed.

FIG. 9 illustrates a cross section view of the semiconductor deviceshown in FIG. 8 after an interconnect bump is formed on the backsidecontact in accordance with various embodiments of the presentdisclosure. The bump 172 provides an effective way to connect thesemiconductor device with external circuits (not shown). In accordancewith an embodiment, the bump 172 may be a solder ball. The solder ball172 may be made of any of suitable materials. In accordance with anembodiment, the solder ball 172 may comprise SAC405. SAC405 comprises95.5% Sn, 4.0% Ag and 0.5% Cu.

In accordance with another embodiment, the bump 172 may be a copperbump. The copper bump may be of a height of approximately 45 um. Thecopper bump may be formed by using a variety of semiconductor packagingtechnologies such as sputtering, electroplating and/or the like.

In accordance with an embodiment, a device comprises a first sideinterconnect structure over a first side of a substrate, wherein activecircuits are in the substrate and adjacent to the first side of thesubstrate, a dielectric layer over a second side of the substrate, a padembedded in the dielectric layer, the pad comprising an upper portionand a bottom portion formed of two different materials and a passivationlayer over the dielectric layer.

In accordance with an embodiment, a device comprises a dielectric layerover a backside of a substrate comprising active circuits, a pad in thedielectric layer, wherein the pad comprises an upper portion and abottom portion formed of two different materials and sidewalls of theupper portion are surrounded by the bottom portion and a passivationlayer over the dielectric layer, wherein the bottom portion is incontact with the passivation layer.

In accordance with an embodiment, a device comprises a front sideinterconnect structure over a front side of a substrate, an interlayerdielectric layer between the substrate and the front side interconnectstructure, a dielectric layer over a backside of the substrate, a pad inthe dielectric layer, the pad comprising an upper portion and a bottomportion formed of two different materials and a passivation layer overthe dielectric layer.

Although embodiments of the present disclosure and its advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the disclosure as defined by the appendedclaims.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the present disclosure, processes, machines,manufacture, compositions of matter, means, methods, or steps, presentlyexisting or later to be developed, that perform substantially the samefunction or achieve substantially the same result as the correspondingembodiments described herein may be utilized according to the presentdisclosure. Accordingly, the appended claims are intended to includewithin their scope such processes, machines, manufacture, compositionsof matter, means, methods, or steps.

What is claimed is:
 1. A device comprising: a first side interconnectstructure over a first side of a substrate, wherein active circuits arein the substrate and adjacent to the first side of the substrate; adielectric layer over a second side of the substrate; a via partiallyextending through the dielectric layer; a pad embedded in the dielectriclayer, the pad comprising an upper portion and a bottom portion, thebottom portion being formed of a first conductive material, the upperportion being formed of a second conductive material different than thefirst conductive material, wherein sidewalls of the upper portion arecompletely covered by the bottom portion; a first metal line embedded inthe dielectric layer, the first metal line being formed of the firstconductive material, wherein an entirety of an upper surface of thefirst conductive material of the first metal line is planar with anupper surface of the first conductive material of the pad and an uppersurface of the second conductive material of the pad; and a passivationlayer over the dielectric layer, and wherein the pad is in thedielectric layer, and the bottom portion of the pad is in contact withthe via and the passivation layer.
 2. The device of claim 1, wherein: awidth of the pad is greater than a width of a first metal line embeddedin the dielectric layer.
 3. The device of claim 1, further comprising:an isolation region in the substrate; and a second metal line embeddedin the dielectric layer, wherein a distance between the first metal lineand the isolation region is substantially equal to a distance betweenthe isolation region and the second metal line.
 4. The device of claim1, wherein sidewalls of the upper portion of the pad are tapered.
 5. Thedevice of claim 1, wherein: the first conductive material is copper; andthe second conductive material is nickel.
 6. The device of claim 1,further comprising: a bump over the pad, wherein a bottom portion of thebump is surrounded by the passivation layer.
 7. A device comprising: adielectric layer over a backside of a substrate comprising activecircuits; a via extending through the substrate and partially throughthe dielectric layer; a pad in the dielectric layer and in contact withthe via, wherein: the pad comprises an upper portion and a bottomportion formed of two different materials; and sidewalls of the upperportion are surrounded by the bottom portion; and a passivation layerover the dielectric layer, wherein the bottom portion is in contact withthe passivation layer.
 8. The device of claim 7, further comprising: asurface of the upper portion of the pad is substantially level with asurface of the dielectric layer.
 9. The device of claim 7, furthercomprising: a plurality of metal lines in the dielectric layer, wherein:top surfaces of the plurality of metal lines are substantially levelwith a top surface of the pad; and bottom surfaces of the plurality ofmetal lines are substantially level with a bottom surface of the pad.10. The device of claim 9, further comprising: an interlayer dielectriclayer over a front side of the substrate, wherein a gate is formed inthe interlayer dielectric layer.
 11. The device of claim 10, furthercomprising: a front side interconnect structure over the front side ofthe substrate, wherein the front side interconnect structure isconnected to the active circuits through the via and the plurality ofmetal lines.
 12. The device of claim 9, further comprising: a bump overthe upper portion of the pad, wherein the bump and the bottom portion ofthe pad are separated by the passivation layer.
 13. A device comprising:a front side interconnect structure over a front side of a substrate; aninterlayer dielectric layer between the substrate and the front sideinterconnect structure; a dielectric layer over a backside of thesubstrate; a via extending into the dielectric layer; a redistributionline extending into the dielectric layer; a pad in the dielectric layer,the pad comprising an upper portion and a bottom portion formed of twodifferent materials, wherein sidewalls of the upper portion of the padare tapered, the bottom portion and the redistribution line being formedof a same material, an upper surface of the redistribution line beingfree of a material of the upper portion, the upper surface of theredistribution line, an upper surface of the bottom portion, and anupper surface of the upper portion being planar; and a passivation layerover the dielectric layer.
 14. The device of claim 13, wherein: the viaextends through the interlayer dielectric layer and the substrate. 15.The device of claim 14, wherein: the via is in contact with the bottomportion of the pad.
 16. The device of claim 13, wherein: sidewalls ofthe upper portion of the pad are surrounded by the bottom portion of thepad.
 17. The device of claim 13, wherein: a surface of the bottomportion of the pad is in contact with the passivation layer.
 18. Thedevice of claim 13, wherein: the bottom portion of the pad is betweenand in contact with the via and the passivation layer.
 19. The device ofclaim 1, wherein: the via extends through the substrate.
 20. The deviceof claim 7, wherein sidewalls of the upper portion are tapered.